Casting of 1K and 2K resins as well as foams as a service.
endin – competent & reliable
Main use of casting technology
Electronics encapsulation is a critical process in electronics manufacturing in which electronic components, circuit boards, printed circuit boards and interconnects are encapsulated and encapsulated with a protective material.
The encapsulation protects the electronic components from environmental influences such as:
encapsulation of electronics
Whether you need to pot a printed circuit board or waterproof your connectors, you'll always receive exclusive quality in the potting process with us. Potting compounds of the highest quality, tested and certified batch after batch, as well as years of experience, ensure your optimal results. We can supply limited test quantities as well as large quantities.
We're happy to take care of purchasing, assembly, testing, and even delivery for you. At endin, innovative technology, common sense, and years of experience go hand in hand.
Here's an example of our work: We developed a customized method in collaboration with Iso-Elektra Using the endin MIXAPLY different polyurethane mix ratios were applied layer by layer. The result was a hard shell with a soft core, perfectly tailored to the requirements. A good example of how various properties of the encapsulating material can be customized.
Casting small components is a delicate matter that must be carried out with extreme precision. The casting compounds usually consist of several components and must be precisely measured and mixed according to the specified mixing ratio before casting. This ensures that neither too much nor too little homogeneous casting material ends up exactly where it's needed.
It is important to ensure that the encapsulation completely encloses the entire component or assembly and that there are no air bubbles or voids Hohlräume as these can impair the protective function.
Another important factor for effective sealing and mechanical stability in the casting process is good adhesion of the casting material to the substrate. Inadequate adhesion could lead to delamination and, consequently, leaks. Applying a primer has proven effective for this purpose.
Sealing electronic boards, connectors, etc. with different synthetic resins gives the assemblies:
Protection against environmental influences and thus
more longevity,
higher performance and enables
further miniaturization.
Potting electronics contributes to the mechanical stabilization of assemblies by absorbing vibrations and mechanical stress. When water or even chemicals come into play, the requirements rise to a completely different level. If the electronic component needs to be waterproof, the potting compound must not warp when the environment changes. A change in its properties is also undesirable. Waterproof or chemical-resistant potting can therefore only be guaranteed with the correct potting compound and a repeatable process.
Improving mechanical stability and thermal properties is particularly important for assemblies used in demanding environments, such as in the automotive industry, aerospace, explosion protection, high-voltage electronics, medical technology, smartphones and even household electronics.
Overall, the performance of the electronics is improved by:
Hardly any high-quality electronic component can survive without encapsulation. When electronic insulation combined with water resistance and heat dissipation is required, electronic encapsulation offers the perfect solution. The requirements for encapsulation quality and the material used are correspondingly high.
There are a variety of encapsulation materials with different properties, so the selection can and must be tailored to the specific requirements of the application. The most common materials used for electronic encapsulation are epoxy resins, polyurethanes, and silicones. These can also be used as adhesives or foams. Some encapsulation materials can contain harmful chemicals. It is important to choose materials that meet environmental and health standards. We place particular emphasis on this.
The curing times of the potting materials can vary and affect the efficiency of the production process. Curing times that are too long can slow production speeds and cause unnecessary costs. Curing times that are too short have a negative impact on stability.
The curing of the potting material can be temperature-dependent. Precise temperature control is necessary to ensure the desired properties of the potting compound. We have optimally designed furnaces for this purpose.
Overall, electronic encapsulation is an essential protection mechanism for electronic assemblies to optimize their performance and service life. Careful planning, material selection, and process control are crucial to achieving the desired results and overcoming potential challenges. Therefore, leaving encapsulation to a professional is always the best choice.
There is a suitable endin solution for every challenge.
Electronic encapsulation is a process in which electronic components, circuit boards, and connectors are encased in encapsulating material. This protects the electronics from environmental influences such as moisture, dust, vibration, and chemical attack.
The most common encapsulation materials are epoxy resins, polyurethanes, and silicones. These can be used as resin, foam, or adhesive, depending on the application.
Potting protects electronic components from external influences, improves mechanical stability, increases longevity, and enables miniaturization of components. It also ensures efficient heat dissipation and increases dielectric strength.
The bubble-free, fully encapsulated encapsulation makes the electronics watertight. Good material adhesion and a precise process are crucial for a tight seal.
Electronic encapsulation is used in:
Curing time varies depending on the material and process. Precise temperature control is important to ensure the desired properties.
The material properties must meet specific requirements, such as water resistance, chemical resistance, or thermal conductivity. Furthermore, substances that are harmful to the environment and health should be avoided.
Yes, endin develops customized potting solutions that are perfectly tailored to your requirements. One example is our collaboration with Iso-Elektra, which developed a potting material with a hard shell and a soft core.
Yes, we offer solutions for prototypes, test batches, and large-scale serial production.
We take care of:
We ensure the highest quality and precision throughout the entire process.
It makes sense to draw on experience and expertise early on in the implementation of your projects. Arrange a free initial consultation – we are your competent advisor for the entire value chain.
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