Contract potting & foaming

Potting Service for 1C and 2C resins and foams

For each task we find the way together!

The processing of 1- and 2-component potting compounds, adhesives and sealants  as also the potting and foaming machine engineering are forming the technological backbone of ENDIN. A growing team of experienced employees produces in multi-shift operation on our 16 dispensing systems for our industry customers.

Our dispensing systems are equipped with a specially developed PID flow control. This own, novel regulation simplifies the operation and enables an “online” quality control.

Because of many years of experience in the dispensing technology, we are a perfect partner in the planning of production processes. Whether material, machine or manufacturing processes, we advise you INDEPENDENT and FAIR.

We can everything that the potting material can

This casting method is used where sensitive electronic components must be protected against external influences. For casting, we are using different mixing principles: static or dynamic mixing.

In static mixing, the materials are mixed in a mixing tube. This variant is used with materials that have compounds with a similar viscosity and a mixing ratio nearly 1 to 1.

In dynamic mixing, there is a mixing chamber with a rotating mixer. Since the speed of the mixer is electronically adjustable, the mixing intensity can be controlled precisely to obtain an absolutely uniform mixing. This variant is used for materials that are very different in their viscosity. Each mixing ratio is generally possible

Mixing possible: We are professionals in being able to mix the most diverse components together, which gives you the best possible product properties.

Mixing:

o   Dynamic

o   Static

Control:

o   Flowmeter

o   Pressure

o   Weigting

 

Curing:

o   Oven

o   Infrared

o   UV-Light

 

Pretreatment:

o   Preheating

o   Plasma

o   Primer

 

Branches:

o   Automotive

o   Electronic

o   Filters

o   Housings

o   Medizintechnik

 

 

We can everything that the potting material can

Due to the minimal distances between the electronic components and the board, air bubbles may form during casting under atmosphere. These air bubbles can lead to the destruction of individual components at extreme temperatures and thus to failures in the electronics. This can be avoided by casting under vacuum. In this special process, the mixing unit is located in a chamber with negative pressure, so that the assemblies are optimally filled. In this way, we support the high quality requirements of components in high voltage technology as well as in EX protection. But even your assemblies, which are exposed to large temperature fluctuations, benefit qualitatively from this process.

 

Mixing:

o   Dynamic

o   Static

Control:

o   Flowmeter

o   Pressure

o   Weigting

 

Curing:

o   Oven

o   Infrared

o   UV-Light

 

Pretreatment:

o   Preheating

o   Plasma

o   Primer

 

Branches:

o   Automotive

o   Electronic

o   Filters

o   Housings

o   Medical care

 

Sealing, Gasketing, ENDINing

By using high-quality 1C or 2C sealants or foam, in conjunction with our seal application technology, we are able to provide your assemblies with 3D seals, also known as liquid gaskets or form-in-place gaskets, or potting  in dam and fill.

If you require UV curing, we can cover both the UVA and the UVB range and measure the UV intensity with calibrated instruments.

In combination with plasma or primer treatment, materials may also be used Special features that form-in-place gaskets can meet:

  • Temperature resistance
  • UV resistance
  • Silicone freedom
  • Adapt volume resistivity for EMC applications

Our application engineers analyzes your tasks  and develop the technical solution!

We assume the LIABILITY for your gluing tasks

Glue! Actually a simple thing.

Two components should stick to each other. But only at first glance, because important factors such as: material, ambient temperature, adhesive surface, environmental influences, static and dynamic load and aging are playing a part.

Our close cooperation with adhesive manufacturers and the use of plasma or primer treatments, open all the way to a reasonable adhesion, even on difficult substrates. The application of adhesive can take place either over the entire surface, caterpillar or selectively. Use of UV or superglue does not cause us any problems.

Not only the chemistry must be right!

For foam applications, the constraints are very important. While for a potting material are more important  the “inner values”, the external influences are decisive in foam.

The decision for 1C or 2C foam results mainly from the amount of foam needed. The fineness of a foam bead can be important. Whether the foam should be open or closed porosity, or its chemical or UV resistance, provide information in the selection of the material.

Curing takes place in 1C foams under heat and in 2-component foams at room temperature or accelerated under heat.

Electronic potting
Cable bushing potting
Foam Sealing through form in place
Vacuum potting