Die King Class. We can everything that the potting material can!
They speak always about air bubbles when it comes to potting. The only safe way to reach air bubble free casting is potting under vacuum.
The distance between electronic components and circuit board “guarantees” in many cases in casting under atmospheric pressure, the formation of air pockets (see drawing).
Warping forces at this point, mainly arise during temperature fluctuations may lead to the destruction of the adjacent components and “unexplained failures” of the electronics in field.